Publications

240 results for AI Hardware

Voids-free Die-level Cu/ILD Hybrid bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2023
- ECTC 2023
Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- - Atom O. Watanabe
  - Xiaoxiong Gu
  - et al.
- 2023
- ECTC 2023
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- - Duixian Liu
  - Xiaoxiong Gu
  - et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- - Ram Krishna
  - Atom O. Watanabe
  - et al.
- 2023
- ECTC 2023
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- - Shrivani Pandiya
  - Serge Ecoffey
  - et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2023
- iTHERM 2023
HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results
- - Frank R. Libsch
  - Hiroyuki Mori
- 2023
- ECTC 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- - Griselda Bonilla
- 2023
- iTHERM 2023