Factors Affecting the Molybdenum Line Slope by Reactive Ion Etching
- Yue Kuo
- 2019
- JES
Publications
509 results at JES
Redeposition during Deep Trench Etching
- Jacob Jorne
- 2019
- JES
Reactive Ion Etching of GaAs in Chlorine and Resulting Surface Damage
- B.S. Lee
- H. Baratte
- 2019
- JES
Electrochemical Properties of Polyimides and Related Imide Compounds
- A. Viehbeck
- M.J. Goldberg
- et al.
- 2019
- JES
The effect of organometallic structure
- Thomas H. Baum
- 2019
- JES
Simulation of Leveling in Electrodeposition
- John O. Dukovic
- Charles W. Tobias
- 2019
- JES
XPS Studies on Emersed Silver Electrodes: Coverage and Bonding State of Specifically Adsorbed Chloride
- Wolfgang Kautek
- Joseph G. Gordon
- 2019
- JES
Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes
- S. Mehdizadeh
- J. Dukovic
- et al.
- 2019
- JES
Oxidation Phenomena of Polysilicon/Tungsten Silicide Structures
- L. Nesbit
- 2019
- JES
Plating of Copper into Through-Holes and Vias
- Richard C. Alkire
- Lubomyr T. Romankiw
- 2019
- JES