Electromigration and diffusion in pure Cu and Cu(Sn) alloys
- C.-K. Hu
- K.L. Lee
- et al.
- 1996
- MRS Spring Meeting 1996
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14 results at MRS Spring Meeting 1996
Residual stress and lattice distortion mapping of patterned devices which failed electromigration testing using the microbeam X-ray diffraction (MXRD) technique
- B.R. York
- H.L. Pfizenmayer
- et al.
- 1996
- MRS Spring Meeting 1996
Dependence of crystallographic texture of C54 TiSi2 on thickness and linewidth in submicron CMOS structures
- V. Svilan
- K.P. Rodbell
- et al.
- 1996
- MRS Spring Meeting 1996
Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testing
- T.M. Shaw
- C.-K. Hu
- et al.
- 1996
- MRS Spring Meeting 1996