Residual stress and lattice distortion mapping of patterned devices which failed electromigration testing using the microbeam X-ray diffraction (MXRD) techniqueB.R. YorkH.L. Pfizenmayeret al.1996MRS Spring Meeting 1996
Dependence of crystallographic texture of C54 TiSi2 on thickness and linewidth in submicron CMOS structuresV. SvilanK.P. Rodbellet al.1996MRS Spring Meeting 1996
Nanofoam porosity measured by infrared spectroscopy and refractive indexM.I. SanchezJ.L. Hedricket al.1996MRS Spring Meeting 1996
Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testingT.M. ShawC.-K. Huet al.1996MRS Spring Meeting 1996