Publications

23 results at ECTC 2023

Voids-free Die-level Cu/ILD Hybrid bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2023
- ECTC 2023
Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- - Ram Krishna
  - Atom O. Watanabe
  - et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- - Atom O. Watanabe
  - Xiaoxiong Gu
  - et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- - Sathya Raghavan
  - Aakrati Jain
  - et al.
- 2023
- ECTC 2023
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- - Griselda Bonilla
  - Brian Quinlan
  - et al.
- 2023
- ECTC 2023
Module, antenna, and package design considerations for mm-scale IoT devices
- - Arun Paidimarri
  - Duixian Liu
  - et al.
- 2023
- ECTC 2023
Extracting Anisotropic Permittivity of PCB Substrate from VNA Measurement on a Rectangular Stripline Resonator Loaded with a Via Array
- - Zhaoqing Chen
  - Hung Nguyen
  - et al.
- 2023
- ECTC 2023