Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
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Kinetics of Oxygen Gas Evolution on Hydrous Rhodium Oxide Films
- Eugene J.M. O'Sullivan
- Laurence D. Burke
- 2019
- JES
Electrochemical Properties of Polyimides and Related Imide Compounds
- A. Viehbeck
- M.J. Goldberg
- et al.
- 2019
- JES
Electroplated Magnetic Media with Vertical Anisotropy
- Jean Horkans
- I-Chia Hsu Chang
- et al.
- 2019
- JES
Reactive Ion Etching of PECVD Amorphous Silicon and Silicon Nitride Thin Films with Fluorocarbon Gases
- Yue Kuo
- 2019
- JES
MS Studies of Anodic Surface Films on Copper Electrodes
- Joseph G. Gordon IIW
- 2019
- JES
Interface Properties of Hydrogenated Amorphous Carbon Films on Ge(100) Surfaces
- M. Wittmer
- D. Ugolini
- et al.
- 2019
- JES
Various Properties of Sputter-Deposited HfB2 Films
- J.M. Eldridge
- A.R. Forouhi
- et al.
- 2019
- JES
Redeposition during Deep Trench Etching
- Jacob Jorne
- 2019
- JES
Reactive Ion Etching of GaAs in Chlorine and Resulting Surface Damage
- B.S. Lee
- H. Baratte
- 2019
- JES