Silicon photonic co-packaging: Adhesive dispense challenge and control
- Paul Gond-Charton
- Sebastien Gouin
- et al.
- 2023
- ECTC 2023
Publications
23 results at ECTC 2023
Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023