Module, antenna, and package design considerations for mm-scale IoT devices
- Arun Paidimarri
- Duixian Liu
- et al.
- 2023
- ECTC 2023
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Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023