Chip-level power-performance optimization through thermally-driven across-chip variation (ACV) reductionX. YuOleg Gluschenkovet al.2011IEDM 2011
Graphene technology with inverted-T gate and RF passives on 200 mm platformShu-Jen HanAlberto Valdes-Garciaet al.2011IEDM 2011
Fundamental aspects of HfO 2-based high-k metal gate stack reliability and implications on t inv-scalingE. CartierAndreas Kerberet al.2011IEDM 2011