Effects of alloying elements on cobalt silicide formation
- C. Lavoie
- C. Cabral Jr.
- et al.
- 2002
- Journal of Electronic Materials
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Studies of the mechanical and electrical properties of lead-free solder joints
- S.K. Kang
- W.K. Choi
- et al.
- 2002
- Journal of Electronic Materials
A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique
- W.K. Choi
- S.K. Kang
- et al.
- 2002
- Journal of Electronic Materials
High conductivity copper-boron alloys obtained by low temperature annealing
- S.-L. Zhang
- J.M.E. Harper
- et al.
- 2001
- Journal of Electronic Materials
Characterization of electroplated bismuth-tin alloys for electrically conducting materials
- S.K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Journal of Electronic Materials
SiGe MOSFET structures on silicon-on-sapphire substrates grown by ultra-high vacuum chemical vapor deposition
- P.M. Mooney
- J.O. Chu
- et al.
- 2000
- Journal of Electronic Materials
Transfer of semiconductor and oxide films by wafer bonding and layer cutting
- Qin-Yi Tong
- Li-Juan Huang
- et al.
- 2000
- Journal of Electronic Materials
Development of conducting adhesive materials for microelectronic applications
- Sung K. Kang
- S. Purushothaman
- 1999
- Journal of Electronic Materials
Study of interfacial reactions between tin and copper by differential scanning calorimetry
- S.K. Kang
- S. Purushothaman
- 1998
- Journal of Electronic Materials
Silicide interfaces in silicon technology
- F.M. D'Heurle
- 1998
- Journal of Electronic Materials