Annealing and impurity effects in co thin films for MOL Contact and BEOL metallization
- James Kelly
- Vimal Kamineni
- et al.
- 2018
- JES
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A comparative testing study of commercial 18650-format lithium-ion battery cells
- Valentin Muenzel
- Anthony F. Hollenkamp
- et al.
- 2015
- JES
Tin incorporated in copper films during damascene copper electrodeposition
- S. Kitayaporn
- Qiang Huang
- et al.
- 2014
- JES
Electrochemical palladium deposition for reducing critical dimensions in nanostructures
- Asli Sahin
- Qiang Huang
- et al.
- 2014
- JES
Impurities in the electroplated sub-50 nm cu lines: The effects of the plating additives
- Qiang Huang
- A. Avekians
- et al.
- 2014
- JES
Electroplating of Fe-rich NiFe alloys in sub-50 nm lines
- D. Liang
- J. Liu
- et al.
- 2014
- JES
An electrochemical method of suppressor screening for Cu plating in sub-100 nm lines
- Qiang Huang
- J. Liu
- et al.
- 2014
- JES
BEOL Cu CMP process evaluation for advanced technology nodes
- Kunaljeet Tanwar
- Donald Canaperi
- et al.
- 2013
- JES
PVD Cu reflow seed process optimization for defect reduction in nanoscale Cu/Low-k dual damascene interconnects
- K. Motoyama
- O. Van Der Straten
- et al.
- 2013
- JES
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- James Kelly
- X. Lin
- et al.
- 2013
- JES