Investigation of island formation during through-mask electrochemical micromachiningR.V. ShenoyM. Dattaet al.1996JES
Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutionsI. TeerlinckP.W. Mertenset al.1996JES
Electrochemical Fabrication of Mechanically Robust PbSn C4 InterconnectionsJ. RoederH. Deligianniet al.1995JES
Repassivation Transients Measured with the Breaking-Electrode Technique on Aluminum Thin-Film SamplesC.V. JahnesV. Brusicet al.1995JES
Low Temperature Atmospheric Pressure Chemical Vapor Deposition for Epitaxial Growth of SiGe Bipolar TransistorsD.A. GrutzmacherD.A. Grutzmacher1995JES