The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects
- H.Y. Cheh
- J. Dukovic
- et al.
- 1993
- JES
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Behavior of Cu(P) and Oxygen Free High Conductivity Cu Anodes under Electrodeposition Conditions
- H.S. Isaacs
- A.G. Schroft
- et al.
- 1993
- JES
In Situ Surface Exafs Study of an Underpotentially Deposited Silver Monolayer on Gold (111)
- Mahesh G. Samant
- Gary Borges
- et al.
- 1993
- JES
Fabrication of Tungsten Local Interconnect for VLSI Bipolar Technology
- N.J. Mazzeo
- J.D. Warnock
- et al.
- 1993
- JES
On the Pitting Resistance of Sputter-Deposited Aluminum Alloys
- R.C. Newman
- C.V. Jahnes
- et al.
- 1993
- JES
Effects of Trace Surface Oxidation in Low Temperature Epitaxy Grown from Dichlorosilane
- T.O. Sedgwick
- P. Agnello
- et al.
- 1993
- JES
The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition
- H.Y. Cheh
- J. Dukovic
- et al.
- 1992
- JES
Conditions for an Oxide-Free Si Surface for Low-Temperature Processing: Steady-State Boundary
- P. Agnello
- T.O. Sedgwick
- 1992
- JES
Some Factors Affecting Hillock Formation due to PECVD Processing of Sputtered Al-4% Cu-1% Si Films
- V.J. Minkiewicz
- J.O. Moore
- et al.
- 1992
- JES
New High-Resolution and High-Sensitivity Deep UV, X-Ray, and Electron-Beam Resists
- M. Hatzakis
- K.J. Stewart
- et al.
- 1991
- JES