Direct waste heat utilization from liquid-cooled supercomputersThomas BrunschwilerGerhard Ingmar Meijeret al.2010IHTC 2010
Surface functionalization mechanisms of enhancing heat transfer at solid-liquid interfacesMing HuJavier V. Goicocheaet al.2010IHTC 2010
3D integrated water cooling of a composite multilayer stack of chipsFabio AlfieriManish K. Tiwariet al.2010IHTC 2010