Leakage and contact resistance reduction by diffusion of dopants in NiPt suicide
- Ahmet Ozcan
- Ming Cai
- et al.
- 2011
- ADMETA 2011
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8 results at ADMETA 2011
Effects of Al and Mn impurities on Cu electromigration
- C.-K. Hu
- J. Ohm
- et al.
- 2011
- ADMETA 2011
The materials and integration challenge in implementing & scaling high-k/metal gate transistors for high performance CMOS
- Michael Chudzik
- 2011
- ADMETA 2011
Designing porous ultra low-κ dielectrics to meet scaling challenges
- E. Todd Ryan
- Steve Gates
- et al.
- 2011
- ADMETA 2011
Formation mechanism and suppression methods of copper dendrites in BEOL integration
- Shaoning Yao
- Wei-Tsu Tseng
- et al.
- 2011
- ADMETA 2011
New classes of ULK dielectrics with superior thermomechanical properties
- Yusuke Matsuda
- Sean W. King
- et al.
- 2011
- ADMETA 2011
Reflow of copper on ruthenium
- C.-C. Yang
- Y. Loquet
- et al.
- 2011
- ADMETA 2011
Mn-dopant segregation as an indicator of barrier integrity in 32nm groundrule Cu/ultra-low K interconnects
- Andrew H. Simon
- Frieder H. Baumann
- et al.
- 2011
- ADMETA 2011