Analysis and evaluation methods associated with the application of compliant thermal interface materials in multi-chip electronic board assemblies
- John Torok
- Shawn Canfield
- et al.
- 2011
- SEM Annual Conference on Experimental and Applied Mechanics 2011
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.