Extendibility of PVD barrier/seed for BEOL Cu metallization
- C.-C. Yang
- D. Edelstein
- et al.
- 2005
- IITC 2005
Publications
6 results at IITC 2005
Copper-filled through wafer vias with very low inductance
- Keith A. Jenkins
- Chirag S. Patel
- 2005
- IITC 2005
BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65 nm groundrules
- M. Fukasawa
- S. Lane
- et al.
- 2005
- IITC 2005
New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties
- Dubois Geraud
- Teddie Magbitang
- et al.
- 2005
- IITC 2005
Effect of CoWP cap thickness on via yield and reliability for Cu interconnects with CoWP-only cap process
- J.P. Gambino
- J. Wynne
- et al.
- 2005
- IITC 2005
Characterization of flip chip microjoins up to 40 GHz using silicon carrier
- Chirag S. Patel
- Paul S. Andry
- et al.
- 2005
- IITC 2005