Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ECTC 2005
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6 results at ECTC 2005
Direct integration of dense parallel optical interconnects on a first level package for high-end servers
- Evan G. Colgan
- Bruce Furman
- et al.
- 2005
- ECTC 2005
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
Thermal-mechanical analysis of terabus high-speed optoelectronic package
- Shashikant Hegde
- Lei Shan
- et al.
- 2005
- ECTC 2005
Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2005
- ECTC 2005
Generalized thermal analysis of hotspots on a high power density microprocessor chip
- Kai Xiu
- Mark Ketchen
- 2005
- ECTC 2005