C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Publications
Date
Featured collections
Popular topics
3 results at ICEPT-HDP 2008
Electromigration in Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- ICEPT-HDP 2008
High density 3D integration
- Roy Yu
- 2008
- ICEPT-HDP 2008