Spatial frequency domain analysis of heat transfer in microelectronic chips with applications to temperature aware computing
- Keivan Etessam-Yazdani
- Hendrik F. Hamann
- et al.
- 2007
- ASME Electronic and Photonics Packaging Division 2007
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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5 results at ASME Electronic and Photonics Packaging Division 2007
Comparison of experimental temperature results with numerical modeling predictions of a real-world compact data center facility
- Yasuo Amemiya
- Hendrik Hamann
- et al.
- 2007
- ASME Electronic and Photonics Packaging Division 2007
Fast and accurate simulation of heat transfer in microarchitectures using frequency domain techniques
- Keivan Etessam-Yazdani
- Hendrik F. Hamann
- et al.
- 2007
- ASME Electronic and Photonics Packaging Division 2007
Phonon Boltzmann transport based electro-thermal analysis of nano-scale asymmetrical double-gate finfet device
- Chunjian Ni
- Rajiv V. Joshi
- et al.
- 2007
- ASME Electronic and Photonics Packaging Division 2007
Comparison between numerical and experimental temperature distributions in a small data center test cell
- Madhusudan Iyengar
- Hendrik Hamann
- et al.
- 2007
- ASME Electronic and Photonics Packaging Division 2007