Improved manufacturability of Cu bond pads and implementation of seal design in 3D integrated circuits and packages
- K.N. Chen
- C. Tsang
- et al.
- 2006
- VMIC 2006
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3 results at VMIC 2006
Laser spike annealing: A novel post-porosity treatment for toughening of low-k organosilicates
- Willi Volksen
- Geraud Dubois
- et al.
- 2006
- VMIC 2006
3D integrated circuits and silicon carrier packaging realization
- Cornelia K. Tsang
- Anna W. Topol
- 2006
- VMIC 2006