Thermocompression bonding of aluminum bumps in TAB applications
- Sung K. Kang
- 1998
- ECTC 1998
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3 results at ECTC 1998
Development of low cost, low temperature conductive adhesives
- S.K. Kang
- S. Purushothaman
- 1998
- ECTC 1998
Packaging aspects of the Jitney parallel optical interconnect
- M.S. Cohen
- Glen W. Johnson
- et al.
- 1998
- ECTC 1998