Effects of build-up material properties on warpage dispersion of organic substrates caused by manufacturing variations
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2017
- InterPACK 2017
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4 results at InterPACK 2017
Edge computing and contextual information for the internet of things sensors
- Lavanya Turlapati
- Nigel Hinds
- et al.
- 2017
- InterPACK 2017
The mechanism of the low-k stress reduction in chip assembly by shorter solder bump height
- Keiji Matsumoto
- Keishi Okamoto
- et al.
- 2017
- InterPACK 2017
Monitoring fugitive methane gas emission from natural gas pads
- Levente J. Klein
- Theodore G. Van Kessel
- et al.
- 2017
- InterPACK 2017