Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- Sayuri Kohara
- Toyohiro Aoki
- et al.
- 2022
- ITherm 2022
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5 results at ITherm 2022
Thermal modeling of Direct Bonded Heterogenous Integration (DBHi) MCM package with Si microcooler
- Risa Miyazawa
- Takashi Hisada
- et al.
- 2022
- ITherm 2022
High Performance Compliant Heat Sinks
- Mark D. Schultz
- 2022
- ITherm 2022
Microprocessor Performance with Multiple Cooling Approaches
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2022
- ITherm 2022
Reworkable rehealable packaging materials from the introduction of orthogonal dynamic covalent chemistries
- Teddie Magbitang
- Lucas Moore
- et al.
- 2022
- ITherm 2022