Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- Hiroyuki Mori
- Sayuri Kohara
- 2021
- ECTC 2021
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9 results at ECTC 2021
Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Aakrati Jain
- Kamal Sikka
- et al.
- 2021
- ECTC 2021
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
- Risa Miyazawa
- Chinami Marushima
- et al.
- 2021
- ECTC 2021
High Density Multi-Chip Module for Photonic Reservoir Computing
- Jean Benoit Heroux
- Toshiyuki Yamane
- et al.
- 2021
- ECTC 2021
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- Katsuyuki Sakuma
- Dishit Parekh
- et al.
- 2021
- ECTC 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Kamal Sikka
- Ravi Bonam
- et al.
- 2021
- ECTC 2021
Novel Phased Array Antenna-in-Package Development and Active Module Demonstration for 5G Millimeter-Wave Wireless Communication
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2021
- ECTC 2021
Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
- Keiji Matsumoto
- Marc Bergendahl
- et al.
- 2021
- ECTC 2021