CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- Risa Miyazawa
- Hiroyuki Mori
- et al.
- 2023
- iTHERM 2023
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4 results at iTHERM 2023
Experimental Investigation of Ultra-Thin Microchannel Oscillating Heat Pipes with Submillimeter-Scale Thickness
- Qian Qian
- Xin Zhang
- et al.
- 2023
- iTHERM 2023
SUSTAINABLE COMPUTING – THERMAL CHALLENGES AND OPPORTUNITIES
- Pritish Parida
- 2023
- iTHERM 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- Griselda Bonilla
- 2023
- iTHERM 2023