Publications

2 results at ISSWB 2014

Wafer-level integration of embedded cooling approaches
- - Stephan Paredes
  - Yassir Madhour
  - et al.
- 2014
- ISSWB 2014
Wafer bonding: An integration route for hybrid III-V/SiGe CMOS on 300mm
- - Lukas Czornomaz
  - Nicolas Daix
  - et al.
- 2014
- ISSWB 2014