CVD-Co/Cu(Mn) integration and reliability for 10 nm node
- Takeshi Nogami
- M. He
- et al.
- 2013
- IITC 2013
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3 results at IITC 2013
Subtractive W contact and local interconnect co-integration (CLIC)
- Fei Liu
- Benjamin Fletcher
- et al.
- 2013
- IITC 2013
UV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules
- N. Inoue
- F. Ito
- et al.
- 2013
- IITC 2013