Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
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9 results at ECTC 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Efficient parametric modeling and analysis for backplane channel characterization
- Xiaoxiong Gu
- Ki Jin Han
- et al.
- 2012
- ECTC 2012
Terabit/sec 48-channel fiber-coupled optical module based on holey CMOS transceiver IC
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2012
- ECTC 2012
The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- Gregory Parks
- Babak Arfaei
- et al.
- 2012
- ECTC 2012
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012