Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- James J. Kelly
- Takeshi Nogami
- et al.
- 2011
- ECS Meeting 2011
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7 results at ECS Meeting 2011
Mechanism study of Ag catalyzed directional etch of silicon for nanowire formation
- Ingrid Shao
- Lynne Gignac
- 2011
- ECS Meeting 2011
Residual stress properties of nickel and copper deposits used for C4 interconnects
- Charles Arvin
- G.J. Scott
- et al.
- 2011
- ECS Meeting 2011
Voltage ramp stress based stress-and-sense test method for reliability characterization of Hf-base high-k/metal gate stacks for CMOS technologies
- E. Cartier
- Andreas Kerber
- et al.
- 2011
- ECS Meeting 2011
Robust ultrathin (20-25 nm) trilayer dielectric low k Cu damascene cap for sub-30 nm nanoelectronic devices
- Son Nguyen
- T. Haigh
- et al.
- 2011
- ECS Meeting 2011
Moisture uptake impact on damage layer of porous low-k film in 80nm-pitched Cu interconnects
- M. Tagami
- Atsushi Ogino
- et al.
- 2011
- ECS Meeting 2011
Effect of Al2O3/InGaAs interface on channel mobility
- L. Yang
- C.-W. Cheng
- et al.
- 2011
- ECS Meeting 2011