Mitigation of TSV-substrate noise coupling in 3-D CMOS SOI technology
- Xiaoxiong Gu
- Keith Jenkins
- 2013
- EPEPS 2013
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Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies
- Noam Kaminski
- Evgeny Shumakher
- et al.
- 2013
- EPEPS 2013