An Evaluation of Bath Life Effects on Photoresist Removal for Wafer Level Packaging
- Joel A. Bahena
- Phillip Tyler
- et al.
- 2023
- Advancing Microelectronics
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5 results at Advancing Microelectronics
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- Risa Miyazawa
- Eiji Nakamura
- et al.
- 2021
- Advancing Microelectronics
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- Eiji Nakamura
- Toyohiro Aoki
- et al.
- 2021
- Advancing Microelectronics
A Framework for reshoring of the Outsourced Assembly and Test (OSAT) industry to the US
- Scott Sikorski
- 2023
- Advancing Microelectronics
A surface acoustic wave/polymer gas sensor for use in a hybrid oscillator circuit
- Patrick R. Story
- Claudius Fegerl
- et al.
- 1997
- Advancing Microelectronics