Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- Katsuyuki Sakuma
- Jun Mizuno
- et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.