Publications

3 results at IEEE Transactions on Electronics Packaging Manufacturing

Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- - Katsuyuki Sakuma
  - Jun Mizuno
  - et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
Electrical test strategies for a wafer-level packaging technology
- - David C. Keezer
  - Chirag S. Patel
  - et al.
- 2003
- IEEE Transactions on Electronics Packaging Manufacturing
Interfacial reaction studies on lead (Pb)-free solder alloys
- - Sung K. Kang
  - D.Y. Shih
  - et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing