Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- Son Nguyen
- Huai Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Atharv Jog
Title
BEOL Integration Engineer
Publications
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Top collaborators
DM
Dominik Metzler
Advisory Engineer, BEOL RIE
NL
Nick Lanzillo
Research Staff Member
HH
Huai Huang
BEOL Reliability, Quality and Characterization
VN
Vijay Narayanan
IBM Fellow & StSenior Manager, Materials Innovation for Logic & Chiplets, Analog AI Compute