What’s Next in Semiconductors
is 1 nanometer and beyond
Our chip-driven world owes much of its power and possibility to the semiconductor technologies pioneered at IBM. This legacy of innovation includes the first implementation of 7 nm and 5 nm process technologies, single cell DRAM, chemically amplified photoresists, copper interconnect wiring, silicon on insulator technology, high-k gate dielectrics, embedded DRAM, 3D chip stacking, and more. Today, we continue to push the limits of semiconductor design and packaging with inventions like the 2 nm node chip, vertical transistors, and nanosheet transistor technology.
Our work
How AI is improving chip production
ExplainerPeter HessReimagining storage for the generative AI era
ResearchTalia Gershon, Mike Murphy, Swaminathan Sundararaman, Haris Pozidis, and Khanh NgoHow IBM Research helped prepare the IBM z17 for tomorrow’s workloads
NewsPeter HessWhy a decades old architecture decision is impeding the power of AI computing
ExplainerPeter HessThe 2024 IBM Research annual letter
Deep DiveSriram Raghavan, Mukesh Khare, and Jay GambettaHow analog in-memory computing could power the AI models of tomorrow
ResearchPeter Hess- See more of our work on Semiconductors
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.
Publication collections
ECTC 2025
7
IEEE Electronic Components and Technology Conference
27 MayHPCA 2025
7
IEEE International Symposium on High Performance Computer Architecture
01 MarSPIE Advanced Lithography + Patterning 2025
17
SPIE Advanced Lithography + Patterning
23 FebISSCC 2025
6
IEEE International Solid-State Circuits Conference
16 Feb