Nick Lanzillo

Publications

• Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology

  • • Andrew Simon
    • O. Van Der Straten
    • et al.
  • 2020
  • JVSTA

• Composite Interconnects for High-Performance Computing beyond the 7nm Node

  • • P. Bhosale
    • S. Parikh
    • et al.
  • 2020
  • VLSI Technology 2020

• First-Principles Evaluation of fcc Ruthenium for its use in Advanced Interconnects

  • • Timothy M. Philip
    • Nicholas A. Lanzillo
    • et al.
  • 2020
  • Physical Review Applied

• Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects

  • • Nicholas A. Lanzillo
    • Lawrence Clevenger
    • et al.
  • 2020
  • Journal of Applied Physics

• Surface initiated polymer thin films for the area selective deposition and etching of metal oxides

  • • Thomas G. Pattison
    • Alexander E. Hess
    • et al.
  • 2020
  • ACS Nano

• Chip Power-Frequency Scaling in 10/7nm Node

  • • Phil Oldiges
    • Reinaldo A. Vega
    • et al.
  • 2020
  • IEEE Access

• A Materials Screening Methodology for Scaled Non-Volatile Memory in the AI Era

  • • Nicholas A. Lanzillo
    • R. R. Robison
  • 2019
  • ANTS 2019

• Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects

  • • Nicholas A. Lanzillo
    • Kisik Choi
    • et al.
  • 2019
  • IEEE Electron Device Letters

• Spin-dependent electron scattering in cobalt interconnects

  • • Nicholas A. Lanzillo
    • P. Bhosale
    • et al.
  • 2019
  • Journal of Physics D: Applied Physics

• Technology challenges and enablers to extend Cu metallization to beyond 7 nm node

  • • Takeshi Nogami
    • H. Huang
    • et al.
  • 2019
  • VLSI Technology 2019