We’re developing new materials for both the smallest length scale (<20nm) and largest length scale (>20mm) of semiconductor fabrication.
Projects
Developing a new chiplet integration technology using silicon bridge for advanced semiconductor packaging.
An automated explainable bioinformatics and AI workflow for multi-omic, clinical and experimental data, applied to healthcare and drug discovery problems.
An effort to translate code between programming languages with AI
A highly resilient and high-throughput transaction processing platform
Exploring novel photonic computing approaches by harnessing quantum-optical effects
