Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperThe Etching of Crystallographically Determined Orifices in SapphireA. Reisman, M. Berkenblit, et al.JES
PaperAF-Net: An Active Fire Detection Model Using Improved Object-Contextual Representations on Unbalanced UAV DatasetsXikun Hu, Wenlin Liu, et al.IEEE J-STARS
PaperApplication of block-copolymer supramolecular assembly for the fabrication of complex TiO2 nanostructuresSung Ho Kim, Oun-Ho Park, et al.Small
