ION BEAM TECHNIQUES FOR THE DEPOSITION OF CERAMIC THIN FILMS.
J.M.E. Harper
Emergent Process Methods for High-Technology Ceramics 1983
25-nm-wide lines and spaces have been fabricated in 22.5-nm-thick films of PdAu (40: 60) using electron-beam exposure and polymethylmethacrylate (PMMA) resist. A high-resolution scanning transmission electron microscopy (STEM) was used to expose the resist and the samples were mounted on 60-nm-thick Si 3N4 membrane substrates. Previously, the smallest metal structures formed with a resist process were 60 nm wide with spaces between the lines several times larger than the lines. The results presented here show that 25-nm lines can be fabricated with a center to center spacing of 50 nm.
J.M.E. Harper
Emergent Process Methods for High-Technology Ceramics 1983
C. Lavoie, C. Detavernier, et al.
Microelectronic Engineering
S.-L. Zhang, J.M.E. Harper, et al.
Journal of Electronic Materials
A.N. Broers, W. Molzen, et al.
Applied Physics Letters