Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Publications
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122 results for J.M.E. Harper
Classification of the modes of dissociation in immiscible Cu-alloy thin films
- K. Barmak
- G.A. Lucadamo
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Extendibility of Cu damascene to 0.1 μm wide interconnections
- C.-K. Hu
- K.Y. Lee
- et al.
- 1998
- MRS Spring Meeting 1998
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Surface roughening during titanium silicide formation: A comparison between Si(100) and poly-Si substrates
- C. Lavoie
- R. Martel
- et al.
- 1996
- MRS Fall Meeting 1996
In-plane crystallographic texture of bcc metal thin films on amorphous substrates
- J.M.E. Harper
- K.P. Rodbell
- et al.
- 1997
- MRS Spring Meeting 1997
In-situ X-ray diffraction analysis of TiSi2 phase formation from a titanium-molybdenum bilayer
- C. Cabral Jr.
- L. Clevenger
- et al.
- 1996
- MRS Fall Meeting 1996
Phase formation in Cu(Sn) alloy thin films
- L. Clevenger
- B. Arcot
- et al.
- 1996
- MRS Spring Meeting 1996
Dependence of crystallographic texture of C54 TiSi2 on thickness and linewidth in submicron CMOS structures
- V. Svilan
- K.P. Rodbell
- et al.
- 1996
- MRS Spring Meeting 1996