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Conference paperCharacterization of stacked die using die-to-wafer integration for high yield and throughputK. Sakuma, P. Andry, et al.ECTC 2008
PaperThermally stable ohmic contacts to n-type GaAs. VIII. Sputter-deposited InAs contactsH.-J. Kim, Masanori Murakami, et al.Journal of Applied Physics