Transferrable fine pitch probe technology
- Y. Liu
- S.L. Wright
- et al.
- 2014
- ECTC 2014
Publications
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112 results for S.L. Wright
NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- Bing Dang
- Steven Wright
- et al.
- 2013
- ECTC 2013
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008
Reliability testing of through-silicon vias for high-current 3D applications
- Steven L. Wright
- Paul S. Andry
- et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007