Y. Martin, C.C. Williams, et al.
Journal of Applied Physics
We describe a new type of jet plating that uses a focused high-frequency sound field directed through the center of the jet. The acoustic jet results in an improved morphology for gold and copper depositions although plating rates are not enhanced. Four-point probe measurements of acoustic-jet plated copper lines show up to a 50% decrease in electrical resistivity compared to jet plated deposits.
Y. Martin, C.C. Williams, et al.
Journal of Applied Physics
C.C. Williams, H.K. Wickramasinghe
IUS 1985
David W. Abraham, C.C. Williams, et al.
Applied Physics Letters
Y. Martin, S. Rishton, et al.
Applied Physics Letters