Advanced junction formation for Sub-32nm logic devices

This paper is meant to be a general overview of recent advances in new processes and process tooling (implant and anneal) for advanced junction formation. Also included are details of impact of novel implant processes, such as cold implant and pre-amorphization (PAI) implants on Nickel Silicide (NiSi) formation. We will also discuss subtle impacts of wafer temperature during ion implantation on channel stress retention and shallow junctions in today's advanced device nodes. © 2010 IEEE.