Qing Li, Zhigang Deng, et al.
IEEE T-MI
An interface-marker technique has been used to investigate the relative rates of diffusion of Si and of metal atoms during the growth of metal silicide films. The technique enables recognition of a reference plane in thin film diffusion using Rutherford backscattering, while minimizing any perturbation of the diffusion process. Examples are drawn from studies of the growth of silicides of W, Mo, Ta, Nb, V, Pd and Pt. © 1980.
Qing Li, Zhigang Deng, et al.
IEEE T-MI
Myron R. Melamed, Betty J. Flehinger
Gynecologic Oncology
John M. Prager, Jennifer J. Liang, et al.
AMIA Joint Summits on Translational Science 2017
A. Gangulee, F.M. D'Heurle
Thin Solid Films