Conference paper
Electromigration reliability of advanced interconnects
C.-K. Hu, L. Gignac, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2007
No abstract available.
C.-K. Hu, L. Gignac, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2007
C.-K. Hu, D. Canaperi, et al.
Thin Solid Films
R.F. Liu, C.-K. Hu, et al.
Journal of Applied Physics
C.-K. Hu, D. Canaperi, et al.
IRPS 2004