Conference paperA study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH zC.-K. Hu, D. Canaperi, et al.AMC 2003
PaperHigh-quality aluminum oxide gate dielectrics by ultra-high-vacuum reactive atomic-beam depositionS. Guha, E. Cartier, et al.Journal of Applied Physics
Conference paperChannel Strain Characterization in Embedded SiGe by Nano-beam DiffractionJ. Li, A. Lamberti, et al.ECS Meeting 2008
Conference paperThree-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomographyP.A. Ercius, D.A. Muller, et al.M&M 2006