Donald Samuels, Ian Stobert
SPIE Photomask Technology + EUV Lithography 2007
As semiconductor devices decrease in size, soft errors are becoming a major issue that must be addressed at all stages of product definition. Even before prototype silicon chips are available for measuring, modeling must be able to predict soft-error rates with reasonable accuracy. As the technology matures, circuit test sites are produced and experimentally tested to determine representative fail rates of critical SRAM and flip-flop circuits. Circuit models are then fit to these experimental results and further test-site and product circuits are designed and modeled as needed. © Copyright 2008 by International Business Machines Corporation.
Donald Samuels, Ian Stobert
SPIE Photomask Technology + EUV Lithography 2007
Xiaozhu Kang, Hui Zhang, et al.
ICWS 2008
Oliver Bodemer
IBM J. Res. Dev
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I-SPAN 2002