PaperResistivity of the solid solutions (Co-Ni)Si2F.M. D'Heurle, J. Tersoff, et al.Journal of Applied Physics
Conference paperReactive diffusion in the Ni-Si system: Influence of Ni thickness on the phase formation sequenceC. Coïa, C. Lavoie, et al.ECS Meeting 2005
PaperEffect of alloy additions on electromigration failures in thin aluminum filmsA. Gangulee, F.M. D'HeurleApplied Physics Letters
PaperThermal stability of silicide on polycrystalline SiQ.Z. Hong, Stella Q. Hong, et al.Thin Solid Films