PaperLow-temperature redistribution of As in Si during Pd2Si formationI. Ohdomari, K.N. Tu, et al.Applied Physics Letters
PaperInterdiffusion in copper-aluminum thin film bilayers. II. Analysis of marker motion during sequential compound formationH.T.G. Hentzell, K.N. TuJournal of Applied Physics
PaperMorphology and kinetics of cellular dissolution of the Pb-Sn alloyK.N. Tu, D. TurnbullMetallurgical Transactions
PaperFormation of shallow silicide contacts of high Schottky barrier on Si: Alloying Pd and Pt with W versus alloying Pd and Pt with SiM. Eizenberg, K.N. TuJournal of Applied Physics
