Electromigration study in flip chip solder joints
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- ECTC 2007
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230 results for King-Ning Tu
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
- Albert T. Wu
- N. Tamura
- et al.
- 2005
- MRS Spring Meeting 2005
Approaching the ideal elastic strain limit in silicon nanowires
- Hongti Zhang
- Jerry Tersoff
- et al.
- 2016
- Science Advances
Layered growth of the quasicrystalline decagonal Al3Pd phase in Al/Pd lateral diffusion couples
- B. Blanpain
- J.W. Mayer
- et al.
- 1990
- Physical Review Letters
Submicron void formation in amorphous NiZr alloys
- K.N. Tu
- T.C. Chou
- 1988
- Physical Review Letters
Atomic intermixing and electronic interaction at the Pd-Si(111) interface
- O. Bisi
- K.N. Tu
- 1984
- Physical Review Letters
Interfacial reaction and schottky barrier in metal-silicon systems
- G. Ottaviani
- K.N. Tu
- et al.
- 1980
- Physical Review Letters
Diffusion in the amorphous phase of Pd-19-at.%-Si metallic alloy
- D. Gupta
- K.N. Tu
- et al.
- 1975
- Physical Review Letters
Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
- Albert T. Wu
- J.R. Lloyd
- et al.
- 2005
- APM 2005
SILICIDE CONTACT AND GATE IN MICROELECTRONIC DEVICES.
- K.N. Tu
- 1982
- International Symposium on Methods and Materials in Microelectronic Technology 1982