M. Hargrove, S.W. Crowder, et al.
IEDM 1998
The new high temperature superconductors open up possible applications in magnets, power transmission, computer interconnections, Josephson devices and instrumentation, among many others. This paper presents a case study of one of these applications — the use of superconducting interconnects in 77 K CMOS semiconducting chips and packages. Significant leverage vis-a-vis normal metal interconnects at 77 K appears primarily in the packaging (rather than on-chip) and only at high performance (high frequency). As in other applications, this encourages a long-term view of the impact of high temperature superconductivity. © 1988, Elsevier Science Publishers B.V.. All rights reserved.
M. Hargrove, S.W. Crowder, et al.
IEDM 1998
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials
Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP