A multilevel copper/low-k/airgap BEOL technology
S.V. Nitta, S. Ponoth, et al.
ADMETA 2007
Tensile mechanical behavior of as-cast solid mercury which is relevant to Josephson integrated circuit packaging applications has been studied at 77 K and between 4.2 and 20 K. It was found that solid mercury is ductile, particularly so at temperatures close to 4.2 K. Further, at and near 4.2 K solid mercury exhibits pronounced work hardening, high tensile strength, and markedly serrated flow behavior. A possible explanation of these observations is presented, based on existing information on deformation and transformation characteristics of mercury at cryogenic temperatures.
S.V. Nitta, S. Ponoth, et al.
ADMETA 2007
Sung K. Kang, S. Purushothaman
Journal of Electronic Materials
T. Caulfield, S. Purushothaman, et al.
International Cryogenic Materials Conference 1983
C. Narayan, S. Purushothaman, et al.
MCMC 1994